Analysis
EMI/EMC Analysis
Ajatashatru Technologies offers thorough EMI and EMC analysis at both board and system levels, including:
- Radiated Emission (RE) Analysis: Near-field and far-field assessments.
- RE and Common Mode Emission (CE) Analysis: Evaluations using shielded cases.
- Conduction Noise (CE) Analysis: Modeling for power line interference.
- Frequency vs. dB Plots: Compliance plots for standards like FCC, CISPR, VCCI, or custom specifications.
- Electromagnetic Susceptibility Analysis: Testing device resilience to external fields.
- 3D Magnetic/Electric and Current Density Plots: Visual representations for detailed insights.
Tools
- ANSYS HFSS™
- ANSYS SIwave
- CST Studio Suite
Our EMI/EMC analysis ensures compliance and reliable performance in various environments.
ESD ANALYSIS
- Board-Level and System-Level ESD Analysis
- ESD Circuit Modeling and ESD Gun Modeling
- Air Charge ESD Simulation
- ESD Path Analysis Using 3D Simulation Tools
Tools
- ANSYS HFSS™
- ANSYS SIwave
- CST
THERMAL ANALYSIS
Ajatashatru Technologies provides comprehensive thermal analysis at both PCB and system levels, including:
- Joule Heating Effect Analysis: Power loss assessments on traces.
- Heat Sink and Cooling Proposals: Tailored solutions for optimal thermal management.
- Metal Core and Thermal Ladder PCB Designs: Efficient designs for heat dissipation.
- Heat Transfer Mechanisms: Analysis of conduction, convection, and radiation.
- Detailed Reports: Component and board temperature profiles.
Tools
- ANSYS Icepak
SIGNAL INTEGRITY ANALYSIS
- Interface Analysis: High-speed serial/parallel interfaces (NAND Flash, DDR3/DDR4, PCIe Gen3/4/5, XAUI, LPDDR4x, HDMI, SATA, USB 3.0/4.0).
- Ethernet Standards: Analysis for 25Gbps, 56Gbps, and other Ethernet standards.
- COM Simulations & Metrics: Performance evaluation of communication channels.
- SI & PI Co-design: Simultaneous switching noise (SSN) modeling, power integrity co-design.
- Pre/Post-Layout SI Analysis: Evaluation at different design stages.
- IBIS/IBIS-AMI Evaluation: System-level analysis using behavioral models.
- Routing & Termination Studies: Stack-up design, controlled impedance for traces and vias using EM solvers.
- Full-Wave EM Modeling: Analysis of interconnects (vias, connectors, channels).
- Signal Quality: Reflection, overshoot/undershoot, ringing, signal attenuation (IR-Drop, skin-effect, dielectric loss).
Tools
- ANSYS HFSS™
- Synopsys HSPICE®
- Mentor Graphics® HyperLynx®
- ANSYS SIwave
- Keysight ADS
- Cadence Sigrity
- Intel ICAT
- Channel Analysis: Eye diagrams for serial communication, clock and DDR timing analysis.
- S-Parameter Analysis: In-depth study of return/insertion loss, NEXT, FEXT, and crosstalk.
- Mixed Mode & Coupling Analysis: Common/differential modes, trace coupling, and IC/package/board co-design.
- Connector Design Modeling: Comprehensive modeling of connectors and interconnects.
- IBIS Model Generation: Accurate IBIS modeling for system integration.
POWER INTEGRITY ANALYSIS
- Power Supply Quality Verification: Analyze and ensure stable power delivery.
- Target Impedance Optimization: Estimation and refinement.
- Decoupling Cap Optimization: Efficient estimation and placement.
- Loop Inductance & Stack-up Optimization: Power-ground loop inductance minimization.
- S-Parameter & Parasitic Extraction: R, L, C analysis for accurate modeling.
- IR Drop Analysis: Recommendations for optimal component placement.
- Time-Domain Noise Estimation: Predict and mitigate power integrity noise
Tools
- Mentor Graphics® HyperLynx®
- ANSYS SIwave
- Keysight ADS
- Cadence Sigrity
WIRELESS/ANTENNA ANALYSIS
- Component Design & Antenna Placement
- Antenna Arrays & Co-Site Interference
- Lightning Strike Analysis
- Bluetooth Simulations at PCB and Enclosure Levels
- RLC Matching Circuit for PCB Antenna Impedance
- Radiation Pattern & VSWR Plotting in HFSS
- Electromagnetic Simulation of Antenna & System Interaction
- Matching Tuning Components Recommendations
Tools
- ANSYS HFSS™
- ANSYS SIwave
- Keysight ADS
MECHANICAL ENGINEERING
Ajatashatru Technologies offers a wide range of mechanical and electro-mechanical engineering solutions, serving multiple market segments. Over the years, our expertise has grown, allowing us to deliver high-quality design, testing, and product development services. Our team excels in designing test fixtures, custom test cells, and validating design modifications before physical prototypes.
Our Services Include:
- Enclosure Design
- Product/System Architecture
- Shock and Vibration Simulation
- Thermal Simulation and Analysis
- Material and Component Selection
- Reverse Engineering with CMM and Laser Scanning Technology
- Product Specification Drafting
- 3D Rendering and Prototype Design
Tools
- ANSYS Mechanical Tool
