IC packaging

IC Package Design

Designing High-Quality IC Package Solutions

At Ajatashatru Technologies, IC package design is a key component in the development of advanced chips and systems. We have delivered some of the most sophisticated, high-performance package solutions for leading clients across various industries. Our expertise spans a wide range of packaging technologies, including:

Our Expertise

Focusing on Precision and Reliability in Packaging Design

Our team of design experts specializes in developing ultra-high-performance package designs that ensure maximum reliability. We focus on optimizing key elements, including:

Bump Optimization:
Ensuring better routing, optimized BGA pin-net assignments, and critical routing paths that meet Signal Integrity (SI), Power Integrity (PI), thermal, and manufacturing requirements.

Design for Manufacturing (DFM): Compliance with DFM rules, ensuring smooth manufacturing and cost-effective production.

Diverse Design Experience

We bring extensive experience in designing for various applications, including analog/digital mixed designs, high-speed digital signals, high-power systems, and radio frequency (RF) interfaces. Our capabilities include:

Innovative Engineering Solutions

We have handled a wide array of package designs, from simple to highly complex, delivering best-in-class performance. Our expertise includes:

Flip Chip BGA Designs: Multilayer organic substrate packages with sizes up to 75mm x 75mm.

High-Power Designs: Custom heat spreaders for efficient power dissipation, and support for interfaces such as MIPI, CSI, DSI, DDRx, HDMI, PCIe, ADC/DAC, and SerDes.

Complex Routing: High-density designs with tight length-matching requirements.

Design for Manufacturing (DFM): Compliance with DFM rules, ensuring smooth manufacturing and cost-effective production.

Projects Delivered

Flip Chip BGA Designs:
Up to 18 layers with different pitch sizes, delivering high power and complex routing solutions for cutting-edge applications.

Advanced Packaging Solutions:
From high-speed digital interfaces to RF and analog designs, our packaging ensures reliability and performance.

Advanced Toolkits

We have handled a wide array of package designs, from simple to highly complex, delivering best-in-class performance.
Our expertise includes:

Cadence APD

Mentor Graphics Expedition

Scope of Our IC Package Design Services

Ajatashatru Technologies provides a full range of IC package design services, including:

Our design solutions are engineered for critical industries like defense, aerospace, telecommunications, and IoT, ensuring optimal performance, durability,
and cost-efficiency in even the most demanding environments.

Service Overview

Ajatashatru Technologies Private Limited provides rapid test bring-up services to accelerate time-to-market and reduce costs for IC development. Our team delivers comprehensive software and hardware support for Automated Test Equipment (ATE) and instrument-based testing across a range of IC types, covering characterization, New Product Introduction (NPI), probe, and final testing.

Our expertise extends to designing high-speed, high-density load boards optimized for high-volume manufacturing (HVM). These load boards are engineered to ensure precision and reliability in high-demand environments, whether at foundries or OSAT (Outsourced Semiconductor Assembly and Test) facilities. Additionally, we provide custom kits for probers and handlers, ensuring smooth alignment and seamless operation in production settings.

Ajatashatru Technologies’ solutions are tailored to meet the fast-paced demands of modern semiconductor testing, allowing our clients to streamline test setups, reduce associated costs, and bring products to market faster. With a focus on quality and precision, our services support high-volume, reliable manufacturing processes, making us a trusted partner for end-to-end IC testing solutions. Through our rapid test bring-up services, clients can confidently meet production targets while maintaining efficiency and accuracy throughout the test lifecycle.

Value Proposition

We deliver tailored back-end IC test development, leveraging our expertise in design and Design for Testability (DFT). Key offerings include

Feasibility studies and test process timelines
Adaptability to new test platforms
Test Time Reduction (TTR) audits
Support for in-house testing teams
Quality assurance processes
Long-term partnerships with ATE suppliers and vendors

Full-Turnkey Solutions

Our end-to-end services include:

Bench Validation

We provide bench testing for high-speed digital, analog, mixed-signal, and RF applications, utilizing LabVIEW for automation and integrated instruments for production screening.